| Techniques |
Rigid |
Rigid-Flex |
Flex |
| British
system |
Metric
system |
British
system |
Metric
system |
British
system |
Metric
system |
| Max. Layers |
24 |
16
(sample) with 6 flex
10 (Mass production) with 4 flex |
14
(Sample)
10 (Mass production) |
| Basic material Type |
FR-4
(TG130, TG150, TG170),
Teflon, Rogers, FR-5, ISOLA, taconic Arlon, Nelco, CEM-1, CEM-3,
Alμminμm based, stainless steel, Copper, High CTI |
PI,
FR-4 |
PI,
PET |
| Lead Free HASL |
Y |
Y |
N |
| HASL |
Y |
Y |
N |
| Electroless Nickel
Gold (ENIG) |
Y |
Y |
Y |
| Selective hard gold |
Y |
Y |
Y |
| OSP (Entek CU106A) |
Y |
Y |
N |
| Immersion silver |
Y |
Y |
Y |
| Immersion tin |
Y |
Y |
Y |
| Peelable mask
(blue mask) |
Y |
Y |
Y |
| Carbon ink |
Y |
Y |
Y |
| Jumping V scoring |
Y |
Y |
N |
| AOI |
Y |
Y |
B |
| Ionography |
Y |
Y |
Y |
| Photo capture
capability |
Y |
Y |
Y |
| Flying probe |
Y |
Y |
Y |
| Quality assurance
certificates |
UL
94VO, ISO 9001, TS 16949, ISO 14001 |
| Min. board size |
0.4"x
0.4" |
10mm*10mm |
|
|
| Max. board size |
26.8"*40" |
680mm*1000mm |
8.8"*13.2" |
220mm*330mm |
8.8"*40"
(2L) |
220mm*1000mm(2L) |
| Min. board
thickness - double side |
8mil |
0.2mm |
24mil |
0.6mm |
6.8mil |
0.17mm |
| Min. board
thickness - multilayer |
16mil |
0.4mm |
24mil |
0.6mm |
|
|
| Max. board
thickness - double side |
280mil |
7mm |
128mil |
3.2mm |
19.6mil |
0.49mm |
| Max. board
thickness - multilayer |
280mil |
7mm |
128mil |
3.2mm |
|
| T/C thickness
(Min.) |
3.2mil |
0.08mm |
4mil |
0.1mm |
|
| Finished board
thickness tol. (≥ 0.8mm) |
+/-
10% |
+/-
10% |
+/-
10% |
| Finished board
thickness tol. (< 0.8mm) |
+/-
8% |
+/-
10% |
+/-
8% |
| Twist and warp
(Min.) |
0.75%
diagonal |
|
|
| Buried Vias |
Y |
Y |
|
| Blind Vias |
Y |
Y |
|
| Drill hole
diameter (Max.) |
260mil |
6.5mm |
260mil |
6.5mm |
248mil |
6.2mm |
| Drill hole
diameter (Min.) |
4mil |
0.1mm |
4mil |
0.1mm |
6mil |
0.15mm |
| Base copper
thickness of outer (Min.) |
0.48mil |
12μm |
0.36mil |
9μm |
0.36mil |
9μm |
| Base copper
thickness of outer (Max.) |
14mil |
350μm |
2.8mil |
70μm |
2.8mil |
70μm |
| Base copper
thickness of inner (Min.) |
0.48mil |
12μm |
0.48mil |
12μm |
|
| Base copper
thickness inner (Max.) |
8.4mil |
210μm |
4.2mil |
105μm |
|
| Dielectric
thickness of inner layer (Min.) |
2.8mil |
0.07mm |
2.8mil |
0.07mm |
|
| Aspect ratio of
plated hole (Max) |
13:1 |
10:1 |
|
| Hole diameter
tolerance (PTH) |
+/-
2mil |
+/-
0.05mm |
+/-
2mil |
+/-
0.05mm |
+/-
2mil |
+/-
0.05mm |
| Hole diameter
tolerance (NPTH) |
+/-
1mil |
+/-
0.025mm |
+/-
2mil |
+/-
0.05mm |
+/-
2mil |
+/-
0.05mm |
Hole position
& tolerance
(compared with CAD data) |
+/-
1.52mil |
+/-
0.038mm |
+/-
2mil |
+/-
0.05mm |
+/-
2mil |
+/-
0.05mm |
| Copper thickness
for PTH wall |
1mil |
25μm |
1mil |
25μm |
1mil |
25μm |
| Outer layer design
line width / space (Min.) |
H/H
oz, 4mil /3.5 mil,
1/1 oz , 4mil /3.5 mil,
2/2 oz, 5mil /6 mil,
3/3 oz , 6mil /7 mil,
4/4 oz , 7mil /8 mil |
H/H
oz, 0.1mm/0.0875mm,
1/1 oz , 0.1mm/0.0875mm,
2/2 oz, 0.125mm/0.152mm,
3/3 oz , 0.152mm/0.178mm,
4/4 oz , 0.178mm/0.204mm |
4mil/
4mil |
0.1mm/0.1mm |
3mil/3
mil |
0.075mm/0.075mm |
| Automated plating
line |
Y |
Y |
Y |
| Tolerance after
etching |
+/-
10% |
+/-
20% |
+/-
20% |
| Impedance
tolerance of inner / outer layer Value <
50 ohm |
+/-
5 ohm |
+/-
5 ohm |
|
| Impedance
tolerance of inner / outer layer Value ≥
50 ohm |
+/-
10% |
+/-
10% |
|
| Image to image tol
(Min.) |
+/-
5 mil |
+/-
0.127mm |
|
|
| Image to hole tol
(Min.) |
+/-
4 mil |
+/-
0.102mm |
|
|
| Image to board
edge tolerance (Min.) |
+/-
6 mil |
+/-
0.152mm |
|
|
| Hole to hole
position tol (Min.) D<1.0mm |
+/-
5mil |
+/-
0.127mm |
|
|
| Hole to hole
position tol (Min.) D > 1.0mm |
+/-
3mil |
+/-
0.076mm |
|
|
| Hole to board edge
tol (Min.) D <1.0mm |
+/-
8mil |
+/-
0.204mm |
|
|
| Hole to board edge
tol (Min.) D > 1.0mm |
+/-
6mil |
+/-
0.152mm |
|
|
| Solder mask
registration |
+/-
4mil |
+/-
0.102mm |
|
|
| Solder mask
thickness (Min.) |
0.4mil |
10μm |
0.4mil |
10μm |
|
| Solder mask bridge
(Min.) |
3
mil |
0.076mm |
3
mil |
0.075mm |
|
| Letter width
(Min.) of solder mask opening |
≥
6 mil |
≥
0.152mm |
|
|
| S/M opening space
between gold finger & solder pad
(Min.) |
20
mil |
0.508mm |
|
|
| Nickel thickness
for gold finger |
50μ"-300μ" |
1.25μm-7.5μm |
50μ"-200μ" |
1.25μm-5μm |
|
| Gold thickness of
gold finger (Max.) |
52μ" |
1.3μm |
50μ" |
1.25μm |
|
| Gold thickness of
gold finger (Min.) |
1μ" |
0.025μm |
1μ" |
0.025μm |
1μ" |
0.025μm |
| Gold finger height
(panel edge to top of gold
finger) (Max.) |
17.3"
|
439mm |
|
|
| Tolerance of
chamfer depth |
<30°,
+/- 7mil ;
≥ 30°, +/- 5mil |
<30°,
+/- 0.18mm ;
≥ 30°, +/- 0.127mm |
≥
30°, +/- 5mil |
≥
30°, +/- 0.127mm |
|
| Range of chamfer
angle & chamfer angle tolerance |
20°
- 45°, +/-5° |
20°
- 45°, +/-5° |
|
| Space between gold
finger and TAB (Min.) |
0.275"
|
6.985mm |
|
|
| Nickel thickness
for ENIG (Measured at the minimum
point) (Max.) |
200μ" |
5μm |
100μ"
– 200μ" |
2.5μm-5μm |
120μ"-200μ" |
3μm-5μm |
| Gold thickness for
ENIG (Measured at the minimum
point) (Max.) |
3μ" |
0.075μm |
3μ" |
0.075μm |
3μ" |
0.075μm |
| Immersion silver
thickness |
4μ"
-12μ" |
0.1μm-0.3μm |
|
|
| Solder mask
plugging hole diameter(Max) |
32mil |
0.8mm |
26mil |
0.65mm |
26mil |
0.65mm |
| Immersion Tin
Thickness |
0.94mil-1.26mil |
24μm
– 32μm |
|
|
| Component mark
width (Min) |
5.2mil |
0.13mm |
4mil |
0.1mm |
|
| Solder thickness
on XFP(HAL) (Min) |
0.04mil-0.1mil |
1μm
-2.5μm |
0.04mil-0.16mil |
1μm–
4μm |
|
| Solder thickness
on PADS except XFP(HAL) (Min) |
0.04mil-0.12mil |
1μm
- 3μm |
0.04mil-0.16mil |
1μm–
4μm |
|
| Carbon ink
resistance |
≤
20ohm |
≤
20ohm |
≤
20ohm |
| Space for carbon
conductor (Min) |
10mil |
0.25mm |
10mil |
0.25mm |
|
| Punching dimension
tolerance (Edge to Edge) (Min)
(FR-4) |
+/-
4mil |
+/-
0.1mm |
+/-
4mil |
+/-
0.1mm |
+/-
4mil |
+/-
0.1mm |
| Punching dimension
tolerance (hole to Edge) (Min)
(FR-4) |
+/-
4mil |
+/-
0.1mm |
+/-
6mil |
+/-
0.15mm |
|
| Routing dimension
tolerance (Edge to edge) (min) |
+/-
4mil |
+/-
0.1mm |
+/-
4mil |
+/-
0.1mm |
+/-
4mil |
+/-
0.1mm |
| Routing dimension
tolerance (hole to edge) (min) |
+/-
4mil |
+/-
0.1mm |
+/-
6mil |
+/-
0.15mm |
|
| Radius by routing
(Internal angle) (Min) |
≥
16mil |
≥0.4mm |
|
|
| Countersink hole
depth Tolerance |
+/-
8mil |
+/-
0.2mm |
+/-
8mil |
+/-
0.2mm |
|
| Slot width( min) |
18mil |
0.45mm |
|
|
| Slot tolerance
(PTH) (L≥ 2W+0.15mm) |
+/-
4mil |
+/-
0.1mm |
|
|
| Slot tolerance
(PTH) ( L < 2W+0.15mm) |
+/-5mil |
+/-0.125mm |
|
|
| Non-plated slot
tolerance |
+/-
2mil |
+/-
0.05mm |
|
|
| V-cut remaining
thickness tolerance(Min) |
+/- 4mil |
+/-
0.1mm |
|
|
| V-cut angle
tolerance(30°~60°) (Min) |
+/-5° |
+/-5° |
|
| V-cut
mis-registration (Min) |
+/-
5mil |
+/-
0.125mm |
+/-
5mil |
+/-
0.125mm |
|
| Board thickness
that can be V-cut (Min) |
24mil |
0.6mm |
16mil |
0.4mm |
|
| V-cut to hole
tolerance (Min) |
+/-
6mil |
+/-
0.15mm |
+/-
4mil |
+/-
0.1mm |
|
| V-cut to v-cut
position tolerance (Min) |
+/-
5mil |
+/-
0.125mm |
+/-
2mil |
+/-
0.05mm |
|
| Size from the
V-cut line to board edge (Max) |
14.96"
|
380mm |
|
|
| Peelable Mask
Thickness |
8mil-20mil |
0.2mm
– 0.5mm |
8mil-20mil |
0.2mm
– 0.5mm |
|
