AET produces high density interconnect boards with minimum line / space of 0.050mm (2 mil)
and finished hole size of 0.1mm (0.0039"), up to 24 layers (48 layers for prototypes).
With blind and buried vias, laser drilled vias and impedance control, we manufacture complex
build up boards using a large choice of high quality laminate and prepreg.
Mixed copper thickness, various types of surface finish (hard gold plating, hot air leveling,
immersion tin or silver, ENIG, ENEPIG) and selective gold plating are available with RoHS
We also make HDI any-layer printed circuit boards that are the next technological enhancement
of HDI microvia printed circuit boards: all the electrical connections between the individual layers
consist of laser-drilled microvias. The main advantage of this technology is that all the layers
can be freely interconnected.
Our standard lead time for rigid boards is 2 to 3 weeks. Quick turn around is available on request.
We accept small and medium orders.
We can manufacture rigid PCBs on special materials such as Isola, Rogers RO3007, RO4350B, Teflon, high Tg or high CTI laminates; and even mixed material.